UFP-300A

Features

The UFP 300 series is designed to accommodate all applications of "Through mask plating" processes (also called "patterned plating"), such as redistribution plating and solder bump plating in advanced packaging applications, including wafer level Chip Scale Packaging.
The UFP 300 A system is a fully automated system for high volume production and accommodates 150 and 200 mm wafer sizes. The semi-automated system (UFP 300 S) offers manual wafer loading in combination with automated wafer transfer between cells , or a fully manual system (UFP 300 M) is available which can be used for small volume production or R&D purposes.
The UFP series can be equipped with different plating cell and bath combinations for sequential multiple-stack plating applications, so is easily customisable to fulfil our customers specific needs.

Wafer is vertically immersed.
Capable for multiple plating system.
Minimize plating time by high speed plating.
High throughput.
Applicable process: TSV for 3D stack/CIS, RDL, Microbump, Post, etc.
Applicable metal: Cu, Ni, SnPb, SnAg, Sn, Au, etc.