____Ebara's GCR abatement systems cleanly and efficiently remove carbon monoxide and PFC gases from ashing and oxide etch semiconductor waste streams. The standard GCR model targets CO gases using a high temperature oxidation path. PFC's such as CF4 are decomposed using an optional metal catalyst substrate. High destruction efficiency is accomplished by maximizing the gas residence time inside the high temperature reactor. Two GCR sizes are available to handle a variety of gas loads:
ĦE GCR 120 (max flow 120 SLM at the inlet)
ĦE GCR 250 (max flow 250 SLM at the inlet)
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High efficiency for acid gases, CO |
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Low running cost - chemical resin canister not required for CO |
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Engineered for maximum uptime |
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PFC abatement capability (option) |
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Ion exchange gas sensor (option) |
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SEMI-S2/CE compliance (available Q2 2005) |
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