EBARA continues to expand its role in the semiconductor capital equipment by bringing to market the state of the art plating systems.
The EBARA ECP system offers dry in/dryout, uniform plating on copper Damascene structures. Edge, bevel and backside cleaning are integral to the tool, which also produces high throughput in a small footprint. EBARA's renowned reliability ensures that this tool is very well suited to the manufacturing environment and features a guarantee of greater than 250 hours MTBF and less than 2 hours MTTR. EBARA ECP system integrates well with any PVD or CVD deposited barrier and seed.
The EBARA Through-Mask Plating tool is dry in/dry out capable, easily configurable to different applications and throughput requirements. We can accommodate a large variety of wafer sizes (4" - 12") and an array of different materials, which include tin/lead solder, gold, nickel and copper as well as various Lead Free packaging metals and alloys. Both parallel and serial processing can be accomplished in the Through-Mask Plating equipment, allowing multiple metals to be plated within the same footprint. System flexibility is enabled through modular design and linear robots that can be extended or shortened depending on the number of cells needed for plating.
Our Applications Engineering group was quickly able to bring this product to market by leveraging technologies in which EBARA has a proven track record. The DMP was designed by merging the proven platform and cleaning performance of our CMP tool together with our technology in plating, which has continuously evolved since we entered the plating industry in 1968. The result is a copper plating system which exceeds today's application requirements while achieving throughputs as high as 60 to 80 wafers per hour. The DMP is compatible with seed and barrier deposition, either sputtered or deposited through CVD methods.
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