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| CMP--FREX200 and FREX300 | ||
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____Our Applications Engineering groups located in Japan and the U.S. continue to push the envelope of the challenges required for tomorrow's devices. Whether this entails working on copper and low k dielectric planarization or 300mm, EBARA has a CMP model that meets your need. |
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FREX200 - Chemical Mechanical Polishing Specifications: EBARA's 200 mm CMP system, the FREX200 utilizes EBARA's proven Dry-In / Dry-Out processing technology. The 2 platens, 1 head per platen deign with integrated four clean stations allows for flexibility in serial or parallel operation. Configuration options include: a Buff Polish Station, 4-Cassette Interface, Host Communication (Cim), Multiple Process Monitoring Capabilities, and Slurry/Chemical Supply Units. The FREX 200 is a flexible, user-oriented system.
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FREX300 - Chemical Mechanical Polishing Specifications: EBARA is proud to present its next generation 300 mm CMP system the FREX300. This tool utilizes EBARA's proven Dry-In / Dry-Out processing technology. The two-head/two platen design with integrated four station cleaning allows for flexibility in serial or parallel operation. New features include 3-step chemical clean, buff stations, and 4 FOUP loader ports. The production proven platform extends EBARA's capabilities far beyond the next generation products. A 40% increase in throughput combined with industry leading features makes this the choice of many leading 300 mm fabs. |
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Copyrightc EBARA Presicion Machinery Taiwan Inc. Limited , All Rights Reserved. Best Viewed in MSIE |
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